Also, the classes of testers are seamlessly compatible with each other, users can quickly and easily move semiconductor devices from one class to another even when the mass production scale of the IC changes during the product lifetime can do. V93000 Direct Probe addresses all major contacting challenges (pad probe, Flip Chip, TSV(Through Silicon Vias) and WLCSP) by supporting contact force up to 400 kg and maintaining planarity (1mm over 44,000mm2) for excellent mechanical and electrical contact quality for large die sizes and in high pin count devices such as with MPUs and GPUs. Outsourcing IDMs and fabless companies find V93000 test capacity installed in all leading OSATs worldwide. Maximum Investment Protection and Flexibility, Advantest Corporation ; Page 2 Agilent Technologies shall not be li- able for errors contained herein or consequential damages in connec- tion with the furnishing, perfor-. 0000031852 00000 n n8TJ.Jc\2MUs3\ skM\0s\NY)%wIINi9#AsS,TQQ,z_TT9juF B|rKu6\"]]n Release 5.4.3. New trends in 3D packaging technologies push the envelope of test coverage at probe. The J750Ex-HD is the most mature and market proven platform for automotive MCU test. 0000058497 00000 n Advantest does not, does not intend to, and expressly disclaims any duty to update or correct such information. All Rights Reserved. High density instrumentation enables cost efficient parallel testing, Universal per pin architecture with AWG, DGT, DigIO, DiffVM, TMU, high power functionality, Fully pattern based operation for maximizing the test throughput, Floating design to test high- and low-side power structures, Digital Feedback Loop design for flexible and fast load adaption, With Advantest's V93000 Direct Probe solution, manufacturers can now take a major step forward toward complete high performance functional testing at wafer probe and significantly lower cost of test, Maximum test resource utilization, high parallelism and high throughput for lowest cost of test, Shorter hardware development time and cost due to innovative probe card design, High-performance signal integrity from tester pin electronics to probe tip, Mechanically designed for contact force management and planarity to support large surfaces and high pin counts at wafer test, Certified tolerances matching with Advantest made probe card stiffeners for trouble free operation, Probe card cam lock interlock with probe cards which eliminates realignment need after cleaning interval for superior probe cell efficiency, Controlled and specified deflection characteristics for superior contacting robustness even at very high probe counts (50.000), Enables probe test of high pin count MPU/GPU devices requiring high digital performance and high current contacting, Consumer audio/video, mixed-signal and RF devices that are rapidly moving to wafer-level chip scale packaging (WLCSP) and require high performance probe test. . Also, is a high precision VI resource for analog applications like power management. 0000012694 00000 n Along with integration density there is a continuous increase of logic test content, driving data volumes. Very high speed I/O technology, SerDes based (such as PCIe, HDMI.. ) is proliferating into the very high volume consumer space challenging test economics, test coverage and test strategies. 11 0 obj <> endobj xref 11 73 0000000016 00000 n 0000006892 00000 n The switches operate in a voltage range up to +/-120V and up to 5A pulse power and can be parallelized for higher current applications. New technologies consistently come with new fail mechanisms, such that advanced silicon debug becomes an integral necessity in the race to market. Advantest Corporation Extends Highly Parallel Testing Capabilities. With its flexibility, the Pin Scale 9G can test any combination of parallel or serial, single ended or differential, and uni- or bi-directional interfaces. Both Wave Scale RF and Wave Scale MX cards feature hardware sequencers to control the parallel, independent operation of all instruments. Model: T2000: Class: SOC ATE / Mixed Signal: S-GL-012. The requirements of today's SoC/SIP industry for ever higher speeds, performance and pin counts means that test systems must offer greater functionality while maintaining low cost of test. : Basic of Functional testing / Know what is DC test and AC test) Basic C++ programming knowledge; Linux Operating System; Target Audience : Expected Outcome: This training Introduces the participant to digital performance parameters, specifications, and test methods: Class Duration: 5-days, 9:00 . With it's breakthrough Direct Probe probe card interface technology the V93000 offers 4 times the component space on the probe card with optimal signal integrity to allow known good die testing with higher multisite already at probe. Training course list / schedules (Application Training) - EU, Understanding of electronic device/circuitry, Fundamental semiconductor device test knowledge, Solid SW knowledge, preferable Java or C programming, for Java basics (Java self study material), Key concepts and components of the V93000 system, Understanding of the SmarTest8 SW concepts and how to use them, Setup of test programs using the SmarTest 8 features, Pin configuration setup of levels, timing and vectors, Operating sequence, testflow, test methods, debugging tools and concepts, DC testing, shmoo tools, data logging, test tables, utility lines. E-mail Kantor : spiuho@uho.ac.id The UltraPin1600 implements Teradyne's ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses. Working closely with leading probe card manufacturers, Advantest has successfully overcome traditional barriers to delivering high performance test at wafer probe. The cards 300-MHz bandwidth allows it to handle the most advanced modulation standards while its flexible I/O matrix reduces loadboard complexity and boosts multi-site testing efficiency. Floating licenses which can be shared within a tester or between testers, enable additional capabilities like more speed and more memory while optimizing investments. 0000079887 00000 n ADVANTESTs Wave Scale generation of channel cards for the V93000 platform enable highly parallel multi-site and in-site testing that dramatically reduces the cost of test and ultimately the time to market for current and future devices. The generic approach of the MBAV8 maximizes application coverage and ensures the highest possible utilization, resulting in the industries best return on investment. Working closely with leading probe card manufacturers, Advantest has successfully overcome traditional barriers to delivering high performance test at wafer probe. The class determines the possible size of the configuration and allows to fit the size and performance of the tested device. Its modular design makes it easy to extend the system with new modules and instrumentation, as your test needs change. Advantest Introduces New Module, Extending EVA100 Measurement System's Capabilities to Include High-Voltage Semiconductors, WM2000 Series Now Supported in US, EU and Thailand, Following China and Vietnam. 0000007396 00000 n Micross offers the most complete range of end-to-end microelectronic services, from wafer level packaging, to comprehensive test & inspection. B. Concurrent Test and Multiport In the past, people focused on reducing test time by evaluating multiple subcomponents of a device in parallel. 810~11. 0000031783 00000 n By clicking any link on this page you are giving consent for us to set cookies. Satuan Pengawas Internal UHO 2021. 0000085770 00000 n 0000059009 00000 n More than 1500 switches can be offloaded from the application board into the ATE system to simplify loadboard design. With higher quality signals, the control and performance needed for accurate stimulation and full functional testing of digital, mixed-signal and RF devices directly on the wafer is possible. Scalable support of digital, mixed-signal and RF devices, Ideal for wireless, WLCSP, MPU and GPU devices; Maximum test resource utilization for greatest return on capital investment, Test head in direct contact with probe card, High-performance signal integrity for functional test at wafer stage, High parallelism and throughput to lower cost of test, Contact force up to 300KG with superior planarity, Excellent contact quality for large die and high pin count devices, All per-pin DC resources leading maximum parallelism, Per-pin TMU addressing the pervasive use of local PLL-based time domain synthesis avoiding no special resources and routing, Per-pin sequencing enabling flexible I/O port assignments and concurrent execution of multi domain functions, Versatility and scalability of power supply sources to100's of mili-amps with per resource integrated measurement capability, Flexible vector memory architecture and licensing options enabling a broad mix of deep scan to high speed functional assignment, Leading edge performance cards augment the offering of general purpose capability all the way up the 12.8 GB/s with Pin ScaleSL, Optimized throughput with zero overhead background upload and background calculations enabled by SmartCalc, Very high multi-site efficiency in terms of both throughput and tester resource utilization enabled by Advantest's unique tester per-pin architecture. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. With 32 fully independent instruments per board and an additional PMU at each pogo, it can also perform highly accurate DC measurements. The cards advanced architectures allow for highly parallel testing of multiple communication standards or multiple paths within each device, resulting in high multi-site efficiency and a much lower cost of test. Superior x/y repeatability after cleaning step. TSE: 6857. If there is a survey it only takes 5 minutes, try any survey which works for you. All on one platform, providing our customers the benefit of maximum versatility. User-specific tests are programmed with test methods in C. Links are available for design-to-test conversion. Smart Test, Smart ATE, Smart Scale. 0000006289 00000 n The information in the materials on this Web site speaks as of the date issued. The single load board can leverage existing final test designs and can be shared between wafer probe and final test, reducing hardware development time and hardware cost. Per pin capabilities such as individual clock domain, high accuracy DC and industry-leading digital performance are expanded with the Pin Scale 1600. V93000 SmarTest System Software Downloads, Scalable support of digital, mixed-signal and RF devices, Ideal for wireless, WLCSP, MPU and GPU devices; Maximum test resource utilization for greatest return on capital investment, Test head in direct contact with probe card, High-performance signal integrity for functional test at wafer stage, High parallelism and throughput to lower cost of test, Contact force up to 400KG with superior planarity, Excellent contact quality for large die and high pin count devices. The Wave Scale RF card uses four independent RF subsystems per board, each with eight ports. Extended battery lifetime for mobile devices lead to shrinking supply voltages and require precision force and low leakage measurement capabilities during test. With over 6000 systems installed worldwide, including about 3000 systems at leading Asia subcontractors, the V93000 is widely established and certified at all major IDMs. Superior cross platform compatibility allows our upstream customers to choose from state of the art latest systems or load the same base program on the large fleet of legacy V93000 system for the more mature products, thus picking optimum cost of test operating points. The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change. Wave Scale RF and Wave Scale MX cards help to create paths for testing 5G devices by delivering high-efficiency test solutions for the ICs used in both todays and emerging 5G NR (3GPP new radio), LTE, LTE-Advanced and LTE-A Pro smart phones as well as LTE-M, WLAN, GPS, ZigBee, Bluetooth and IoT applications. January 22, 2021 Smart Coherence for SOC Test 1 Preface - ADVANTEST CORPORATION Agilent -Verigy 93000 and PS 93000 parts available. With an unprecedented channel count and density, the Wave Scale MX high-resolution (HR) card enables the V93000 test platform to achieve the industrys highest parallelism and the most reliable AC and DC performance. Seamless integration with the design tools, full automation of the design to test and test back to design flow and process are key to success. 0000160939 00000 n The Pin Scale 9G is the only fully integrated, high-speed, digital instrument covering the entire range from DC up to 8 Gigabits per second. Advantest now provides the overhauled Direct-Probe infrastructure (bridge beam, stiffeners, alignment & verification tool) for state-of-the-art prober models directly. All features and performance points are available in all classes. Targeted at differential serial PHY technology in characterization and volume manufacturing. Whether you need to address very high pin counts, address a high degree of parallelism and multisite efficiency, address large scan data volumes, support sophisticated power delivery or explore very high speeds or timing accuracy, the V93000 provides solutions across the entire space in one go. 0000343418 00000 n The intent is to provide the skills required to utilize the V93000 tester platform as an integral tool in the engineering and production flows of semiconductor device manufacturing. Because of its high integration and decentralized resources, the Advantest V93000 SoC Series offers unprecedented scalability and control. 3DIC test software development, integration and maintenance. 0000080030 00000 n TSE: 6857. The Pin Scale 1600 digital channel card brings a new dimension in test flexibility. trailer <<6AB4174DC18148BAAEFE70E1956D9BEA>]/Prev 523764>> startxref 0 %%EOF 83 0 obj <>stream 0000008536 00000 n E-mail Admin : saprjo@yahoo.com. testing of symmetrical high-speed interfaces and enhanced SmarTest software functionality. 0000006781 00000 n HLUPTG}@;O High density DPS for massive multi-site applications - extending the power supply versatility of the V93000. )/yx)Aw\ @2za".FO,,D&0NK)O: 7H$FL'VD `R} JRWz fz&pTP ML>"CgT; HH~H>EHy Advantest's Direct Probe reduces the length and number of signal-path connections between tester pin electronics and probe points, significantly improving signal integrity for device testing. Training course list / schedules (Application Training), This training Introduces the participant to digital performance parameters, specifications, and test methods, For people with basic SOC testing knowledge. Calibration, test flow, test methods, debbuging tools, and concepts. V93000 Direct Probe 's innovative probe card design, places the probe assembly directly on the load board, improving test performance and reducing hardware cost and hardware design time from design to production. Through the continuous evolution of the platform, maximizing reuse in the engineering community knowledge base and extending the life time of the tester. 0000009749 00000 n In case you have myAdvantest login, but not privileges, please request it via the Contact Form which you can find in the upper right corner on this page. 0000017827 00000 n The size of the Performance Board is Small and Large, both of which can be connected to all classes of testers. The dual core modules contain resources for both low frequency audio and high frequency capabilities, plus scalability for increasing either the number of source or measure resources, with InstaPin licenses. 0000059227 00000 n InstaPin licenses allow the data rate and memory depth of digital channels to be scaled to match the requirements of the target application, minimizing the cost of carrying unused tester resources. By clicking any link on this page you are giving consent for us to set cookies. 0000012183 00000 n With its scalable platform architecture, the V93000 tests a wide range of devices, from low cost IoT to high end, such as advanced automotive devices or highly integrated multicore processors. TSE: 6857. This design supports simultaneous testing of both receivers and transmitters across as many as 32 sites per card at speeds up to 6 GHz. Coverage from simple low end devices to the most complex high end products requiring the full suite of capabilities: dc, digital, analog and RF. 0000237580 00000 n The AVI64, FVI16 and PowerMUX instruments further expand the usage of the single scalable V93000 test platform with an uncompromised feature set such as: The universal digital pin PS1600 offers high end digital functionality as well as analog test performance.

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